GBT Filed a Continuation Application for its 3D, Multiplanar IC Architecture Patent Seeking to Broaden its Innovative Microchip’s Design and Manufacturing Technology
The continuation patent application seeks to expand the protection of multi-dimensional integrated circuits architecture and semiconductor wafers mounted on the multi-dimensional planes SAN DIEGO, Jan. 20, 2022 (GLOBE NEWSWIRE) — GBT Technologies Inc. (OTC PINK: GTCH) (“GBT” or the “Company”), filed a continuation patent application for its 3D, multiplanar, integrated circuits (IC) design and manufacturing technology. […]