GBT’s first 3D, Multiplanar Microchip Continuation Patent Granted

GBT’s first continuation patent strengthening the new multi-dimensional integrated circuit’s architecture and manufacturing concepts

Patent Granted on August 9, 2022

SAN DIEGO, Aug. 25, 2022 (GLOBE NEWSWIRE) — GBT Technologies Inc. (OTC PINK: GTCH) (“GBT” or the “Company”), first 3D, Multi-Planar IC design and manufacturing technology, continuation patent, was granted by the United States Patent and Trademark Office (“USPTO”) on August 9, 2022. The first continuation patent is focused on strengthening the new microchip’s design and manufacturing concepts and methodologies. A second continuation patent was filed on July 29, 2022, seeking to protect the memory integrated circuit’s architecture and connectivity structures. The original nonprovisional patent protects a system and method to design and manufacture microchips on multi-plane surfaces, enabling placing more electronic circuits on chips, with the goal of enabling faster performance and better electrical characteristics. GBT recently filed an additional patent to enhance its 3D, multi-dimensional concepts. This patent describes a system and method to analyze, calculate and determine the optimal 3D, multi-planar shape to manufacture a chip according to a desired process dimension. The goal of such system, when fully developed, is to predict the most optimal 3D, multidimensional shape to best fit a selected design node.

GBT has invested effort in the integrated circuit field and related EDA design automation technologies, with the goal of developing innovative systems and methods to design and manufacture the next generation of the world’s semiconductor projects. Its 3D, multi-dimensional microchip architecture IP introduces methods to design and manufacture integrated circuits to fit advanced analog, digital, and mixed type ICs on a silicon wafer. The goal is to apply this type of technology in various fields including AI, medical, autonomous vehicles and industrial technologies.

“We have invested significant effort in the integrated circuits arena and we believe that we have developed advancements for the next era of electronics. Our 3D, multi planar patents are aimed to create new horizons for the semiconductor production capacity and its ability to produce cutting-edge chips. Integrated Circuits are vital to our economy and national security, dictating innovations across a wide range of modern technologies. GBT filed three patents in the multi-dimensional field so far and few more in the IC EDA domain. We recently witnessed an increase in the U.S. efforts to make domestic investments in the field as many sectors are directly affected by the semiconductor arena, among them are automotive, data storage, aerospace, medical and industrial technologies. Our world of electronics endlessly demands more circuitries on chips, faster performance, lower power and with cheaper price. We believe that our design, if fully developed, will provide a solution to pioneer the industry into new limits, with the goal of introducing innovative design and manufacturing methods. We foresee that the future for the US semiconductor industry will be focused on building new technologies manufacturing plants, and further investing in advanced R&D in this arena. We believe our 3D, multi-planar intellectual property can lead the industry to the next generation of integrated circuits,” stated Danny Rittman, GBT’s CTO.

About Us

GBT Technologies, Inc. (OTC PINK: GTCH) (“GBT”) (http://gbtti.com) is a development stage company which considers itself a native of Internet of Things (IoT), Artificial Intelligence (AI) and Enabled Mobile Technology Platforms used to increase IC performance. GBT has assembled a team with extensive technology expertise and is building an intellectual property portfolio consisting of many patents. GBT’s mission, to license the technology and IP to synergetic partners in the areas of hardware and software. Once commercialized, it is GBT’s goal to have a suite of products including smart microchips, AI, encryption, Blockchain, IC design, mobile security applications, database management protocols, with tracking and supporting cloud software (without the need for GPS). GBT envisions this system as a creation of a global mesh network using advanced nodes and super performing new generation IC technology. The core of the system will be its advanced microchip technology; technology that can be installed in any mobile or fixed device worldwide. GBT’s vision is to produce this system as a low cost, secure, private-mesh-network between all enabled devices. Thus, providing shared processing, advanced mobile database management and sharing while using these enhanced mobile features as an alternative to traditional carrier services.

Forward-Looking Statements

Certain statements contained in this press release may constitute “forward-looking statements”. Forward-looking statements provide current expectations of future events based on certain assumptions and include any statement that does not directly relate to any historical or current fact. Actual results may differ materially from those indicated by such forward-looking statements because of various important factors as disclosed in our filings with the Securities and Exchange Commission located at their website (http://www.sec.gov). In addition to these factors, actual future performance, outcomes, and results may differ materially because of more general factors including (without limitation) general industry and market conditions and growth rates, economic conditions, governmental and public policy changes, the Company’s ability to raise capital on acceptable terms, if at all, the Company’s successful development of its products and the integration into its existing products and the commercial acceptance of the Company’s products. The forward-looking statements included in this press release represent the Company’s views as of the date of this press release and these views could change. However, while the Company may elect to update these forward-looking statements at some point in the future, the Company specifically disclaims any obligation to do so. These forward-looking statements should not be relied upon as representing the Company’s views as of any date subsequent to the date of the press release.

Contact:

Dr. Danny Rittman, CTO
[email protected]