GBT Filed a Continuation Application for its 3D, Multiplanar IC Architecture Patent Seeking to Broaden its Innovative Microchip’s Design and Manufacturing Technology
The continuation patent application seeks to expand the protection of multi-dimensional integrated circuits architecture and semiconductor wafers mounted on the multi-dimensional planes
SAN DIEGO, Jan. 20, 2022 (GLOBE NEWSWIRE) — GBT Technologies Inc. (OTC PINK: GTCH) (“GBT” or the “Company”), filed a continuation patent application for its 3D, multiplanar, integrated circuits (IC) design and manufacturing technology. The original invention design presents a new way to design and manufacture larger size ICs to fit advanced analog, digital and mixed type ICs on a silicon wafer. The goal of these methods is to enable advanced microchip’s design and manufacturing within less space which can be a significant factor particularly for memories, CPU, GPU, AI chips and more. The company’s 3D microchip patent was filed on March 5, 2019, and was granted as of December 1, 2020 by the United States Patent and Trademark Office (“USPTO”); U.S. Patent No. 10,854,763. The continuation application, assigned number 17102928, was filed on November 24, 2020 and seeks to broaden the protection of the main IP concepts. It is GBT’s goal to allow for further advancements in circuitries connections and wiring through the use of the 3D, multidimensional design utilizing more space on the silicon wafer. This technology aims to increase memory size capacity, speed, performance, and processing power.
“For decades, technology companies have worked to shrink microchips to fit into devices as small as a watch, an earbud or a surgical instrument. Shrinking microchips to make them smaller often means losing space on the chip for performance and functionality, so the movement has turned to three-dimensional microchips. With the hope to maintain efficiency, the ongoing problem with 3D chips is that they rely on traditional interconnectivity methods, including wire bonding and flip chips, to stack vertically. By trying to create a 3D integrated circuit, the stacking of the silicon wafers develops limitations. We believe redesigning the microchip architecture can improve production like routing and the placement of critical building blocks within the IC. One method found to help make these improvements in the architecture of the microchip includes changing the design from the stereotypical flat (or two-dimensional design) to a 3D or layered structure. We believe our approach may alleviates the disadvantages of current ICs by providing new multi-dimensional IC architecture and design. The 3D microchip patent introduces a multi-dimensional, multi-planar IC structure that may potentially be used in IC fabrication. As microchip’s are constantly getting more complex there is a need for a breakthrough technology to enable much larger silicon utilization with higher performance and lower cost. We believe that the technology contemplated by the patent continuation application can be an efficient solution, breaking new grounds in the integrated circuits field, and introducing the next generation of design and manufacturing standards,” said Danny Rittman, the Company’s CTO.
About Us
GBT Technologies, Inc. (OTC PINK: GTCH) (“GBT”) (http://gbtti.com) is a development stage company which considers itself a native of Internet of Things (IoT), Artificial Intelligence (AI) and Enabled Mobile Technology Platforms used to increase IC performance. GBT has assembled a team with extensive technology expertise and is building an intellectual property portfolio consisting of many patents. GBT’s mission, to license the technology and IP to synergetic partners in the areas of hardware and software. Once commercialized, it is GBT’s goal to have a suite of products including smart microchips, AI, encryption, Blockchain, IC design, mobile security applications, database management protocols, with tracking and supporting cloud software (without the need for GPS). GBT envisions this system as a creation of a global mesh network using advanced nodes and super performing new generation IC technology. The core of the system will be its advanced microchip technology; technology that can be installed in any mobile or fixed device worldwide. GBT’s vision is to produce this system as a low cost, secure, private-mesh-network between all enabled devices. Thus, providing shared processing, advanced mobile database management and sharing while using these enhanced mobile features as an alternative to traditional carrier services.
Forward-Looking Statements
Certain statements contained in this press release may constitute “forward-looking statements”. Forward-looking statements provide current expectations of future events based on certain assumptions and include any statement that does not directly relate to any historical or current fact. Actual results may differ materially from those indicated by such forward-looking statements because of various important factors as disclosed in our filings with the Securities and Exchange Commission located at their website (http://www.sec.gov). In addition to these factors, actual future performance, outcomes, and results may differ materially because of more general factors including (without limitation) general industry and market conditions and growth rates, economic conditions, governmental and public policy changes, the Company’s ability to raise capital on acceptable terms, if at all, the Company’s successful development of its products and the integration into its existing products and the commercial acceptance of the Company’s products. The forward-looking statements included in this press release represent the Company’s views as of the date of this press release and these views could change. However, while the Company may elect to update these forward-looking statements at some point in the future, the Company specifically disclaims any obligation to do so. These forward-looking statements should not be relied upon as representing the Company’s views as of any date subsequent to the date of the press release.
Contact:
Dr. Danny Rittman, CTO
[email protected]
